Meet the Experts

Graham K Naisbitt
President / Chariman
Graham Naisbitt



Standards responsibilities:

  • ISO – 9455-17 SIR Testing
  • IEC – 60068-2 Series – Solderability Testing
  • IEC – 61189-5 Test Methods
  • IPC committees:
    • IPC 5-30 – Cleaning & Coating Committee – Vice Chair
    • 5-32g Residues Assessment Task Group
      • Former Chair of 5-32b SIR Testing TG now integrated into 5-32g
    • 5-32a – Ion Chromatography TG
    • 5-32c – Bare Board Cleanliness Assessment TG
    • 5-32e – CAF Testing TG – Vice Chair
    • 5-33a – Conformal Coating TG
    • 5-33b – Solder Mask Performance TG
    • 5-22a – J-STD-001 TG
    • 5-22arose – J-STD-001 ROSE IC Requirements Assessment TG
    • 5-23a – Printed Circuit Board Solderability TG
    • 5-23b – Component & Wire Solderability TG
    • 5-24a – Flux Specifications TG

Authored many Technical papers on Conformal Coating, Reliability Prediction, Electro-Chemical Reliability, Cleanliness Testing, Solderability Testing.

Freeman of the City of London and a Liveryman of The Worshipful Company of Marketors.

DR Chris Hunt
Chief Technology Officer
DR Chris Hunt



Dr Chris Hunt is the CTO at Gen3, and leads the technical development across the company’s product portfolio.

1995 to 2016 Chris built and led the Electronics Interconnection team at the UK’s National Physical Laboratory

2016 to 2020 Lead of a spin-out from NPL to develop a conductive textile technology.
Chris had invented this technology at NPL which was then patented.

Since 1995, Chris has been active in the standards arena.

  • 2002 – 2016 Chair, BSi EPL 501
  • 2012 – 2016 Chair International Electrotechnical Commission (IEC) TC 91

He has also been active in the development of many IPC standards, and has won many awards for this work. Much of his standards work has been in the area of surface insulation resistance measurements and conductive anodic filamentation.

Chris has published more than 40 papers in peer reviewed scientific journals, over 130 NPL scientific reports in the open literature, and over 70 papers appearing conference proceedings.

Gen3 Memberships:

  • IEC TC91 – International Electrotechnical Commission
  • BSi EPL501 – British Standards Institute
  • IPC – US Standards
  • ISO – International Standards Organisation
  • EIPC – European Institute of Printed Circuits
  • iMAPS – International Microelectronics Assembly Packaging Society
  • AIA Aerospace Industries Association – PERM Lead-Free Study Program
  • SAE International – Standards Development
  • HDPUG – High Density Packaging Users Group International
  • SMTA – Surface Mount Technology Association
International Electrotechnical Commission
British Standards Institute
IPC US Standards
International Standards Organisation
European Institute of Printed Circuits
International Microelectronics Assembly Packaging Society
Aerospace Industries Association – PERM Lead-Free Study Program
Standards Development
High Density Packaging Users Group International
Surface Mount Technology Association