Reference Documents
Reference | Document Title | View Document |
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B Mason | No-clean Flux Appraisal - The Total Process Approach - 'The Worlds First OE study' | 135-gec-meters-sir-1994.pdf809.22 KB |
M Routley | Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits | paper-mark-eckold-routley.pdf851.35 KB |
Feng Li | Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effects | ecm-oe-and-modern-fluxes.pdf3.89 MB |
C Hunt | A Gage Study of an Intercomparison Evaluation to Implement the Use of Fine-Pitch Test Patterns for Surface Insulation Resistance (SIR) Testing of Solder Fluxes | gage-r-r-hunt.pdf1.03 MB |
NPL Reports
Reference | Document Title | View Document |
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CMMT (A) 119 | The Impact of Temperature and Humidity Conditions on Surface Insulation Resistance (SIR) Values for Various Fluxes | cmmt119-sir-flux.pdf550.46 KB |
CMMT (A) 122 | Instructions for an Intercomparison of the Surface Insulation Resistance (SIR) Technique | cmmt122-sir.pdf117.95 KB |
CMMT (A) 222 | The Effect of Test Voltage, Test Pattern and Board Finish on Surface Insulation Resistance (SIR) Measurements for Various Fluxes | cmmt222-sir-voltage.pdf1.36 MB |
CMMT (A) 235 | Development of a New Surface Insulation Resistance (SIR) Test Method | cmmt235-sir-new-test-method-1999.pdf1.58 MB |
CMMT (A) 300 | Validation of a New Surface Insulation Resistance (SIR) Test Method | cmmt300-sir-basis-2637.pdf1.87 MB |
CMMT (A) 48 | Surface Insulation Resistance Measurements: A Review of the Various SIR Parameters | cmmt48-sir-1996.pdf333.02 KB |
CMMT 107 | Evaluation of the effect of Ageing on the Cleanability of Solder Flux Residues for Spacecraft Electronic Assemblies | cmmt107.pdf203.1 KB |
MAT 15 | Electrochemical Impedance Technique to Predict Circuit Reliability with Lead-free Solders | mat15-sir-v-eimpedence.pdf2 MB |
MATC (A) 121 | Test Procedure for Process Validation using Surface Insulation Resistance | matc121-sir-process-tb57.pdf593.71 KB |
MATC (A) 70 | Development of Surface Insulation Resistance Measurements for Electronic Assemblies | matc70-sir-eu-project-background.pdf484.12 KB |
IVF Reports
Reference | Document Title | View Document |
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93803 | Evaluation of the Capability of Conformal Coatings to Prevent Degradation of Printed Circuit Assemblies in Harsh Environments | ivf-report-93803.pdf5.67 MB |
93810 | Evaluation of the Compatibilty of Solder Masks and Conformal Coatings | ivf-report-93810.pdf3.85 MB |
93811 | Evaluation of the Influence of Flux Residues on the Reliability of Conformally Coated PCB Assemblies | ivf-report-93811.pdf5.92 MB |
96807 | Evaluation of the Capability of Conformal Coatings to Prevent Degradation of Printed Circuit Assemblies in Harsh Environments - Part 2 | ivf-report-96807.pdf8 MB |
96808 | Evaluation of the Effect of Various Combinations of Solder Masks and Flux Residues on the Reliability of Conformal Coated Circuit Assemblies | ivf-report-96808.pdf8.62 MB |
96809 | Influence of Application Method on the Reliability of Conformal Coated Circuit Assemblie | ivf-report-96809.pdf6.49 MB |
96846 | Evaluation of Test Methods and the Impact of Contamination from Production Processes on the Reliability of Printed Circuit Board Assemblies - Part 3 | ivf-report-96846-part-3.pdf6.31 MB |
96846 | Evaluation of Test Methods and the Impact of Contamination from Production Processes on the Reliability of Printed Circuit Board Assemblies - Part 2 | ivf-report-96846-part-2.pdf7.6 MB |